Abrasive slurry saw wire with abrasive slurry diamond wire without abrasive slurry silicon.
Diamond wire cutting wafer.
This is done in baths with hot water or diluted acid.
It is important that the adhesive does not contaminate the debonding bath and the silicon but adheres to the carrier.
Logitech s model 15 diamond wire disc saw is a compact saw ideal for the precision slicing and dicing of materials from the most delicate crystals to the hardest ceramics.
Our lead times are short and we can accommodate requirements from r d to production quantities.
The working principle is that under a certain tension the wire saw grinds and cuts the object removes the debris and heat with cooling water and finally divides.
We offer contract slicing using diamond wire.
The new environmentally friendly diamond wire technology for wire saws doubles the cutting speed of saws.
Siemens offers optimized automation concepts for high performance ingot cutting machines.
Afterwards the wafers can be separated from the carrier plate without any residues.
200 μm 250 μm wire speed.
Slicingtech serves the needs of companies who require high precision high volume wafer slicing.
Along with a wide range of meyer burger wafer slicing systems we now feature the world renowned state of the art meyer burger dw 288 diamond wire slicing systems for hard and brittle materials.
In addition to the supply of diamond wire we can also provide high quality diamond beads with customized sizes or in the following average diameters.
You can request information concerning quantity details and prices by contacting us or filling in the form.
20 μm 20 μm results subject to change based on process material and cutting orientation parameters cropless ingot process diamond wire.
12 m sec 12 m sec wire tension.
Along with a wide range of meyer burger slicing systems we now feature the world renowned state of the art meyer burger dw 288 and meyer burger dw 265 diamond wire slicing systems for hard and brittle.
310 μm feed rate.
The diamond wire slicing process we employ provides our customers less kerf loss with outstanding finishes to micron level tolerances.
Wafer production places high demands on the technology used while the market demands maximum efficiency from manufacturers.
15 μm 15 μm bow.
The diamond wire cutting head is used whenever there is a requirement to produce a cut with minimum surface and sub surface damage.
15 μm 15 μm warp.
32 n 35 n cut time 180 minutes 150 minutes tv5.
